chip ferrite bead for high speed revision december 18, 2015 1 / 5 @ un semiconductor co., ltd. 2015 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. type 1005 (eia 0402) 1608 (eia 0603) 2012 (eia 0805) l 1.000.10 1.600.15 2.000.20 w 0.500.10 0.800.15 1.250.20 t 0.500.10 0.800.15 0.900.20 e 0.250.10 0.300.20 0.500.30 ? monolithic inorganic material construction ? closed magnetic circuit avoids crosstalk ? smd type & suitable for reflow and wave soldering ? available in various sizes ? excellent solder ability and heat resistance ? high reliability ? with a sharp and frequency frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal filtering between analog and digital circuitry,clock generation circuitry,i/o interconnects,isolation between rf noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted rf energy from corrupting the power generation circuitry.sharp impedance characteristics can effectively minimize attenuation,high frequency emi prevention of lcd monitor,pda,computers, computer peripherals, cellular equipment, digital tv, digital cameras, audio/visual equipment, dvd, wireless communication devices, mp3. ? operating temperature range : - 55 ~ +125 ? storage condition : less than 40 and 70% rh ? storage time: 6 months(size:1005) ? 12 months(size:1608 above) ? soldering method: reflow or wave soldering unit mm
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chip ferrite bead for high speed revision december 18, 2015 3 / 5 @ un semiconductor co., ltd. 2015 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. part no. impedance() +/-25% test freq.(mhz) dcr() (max.) rated current (ma) mcb2012-h series mcb2012h121ebp 120 100 0.25 200 mcb2012h221ebp 220 100 0.25 200 mcb2012h301ebp 300 100 0.25 200 mcb2012h601ebp 600 100 0.35 200 test instruments ? test level 250 mv ? hp4291b rf impedance / material analyzer ? hp4338a/b milliohmmeter ? agilent 8720es s-parameter network analyzer hp6632b system dc power supply part size (eia size) 1005 (0402) 1608 (0603) 2012 (0805) 7 reel qty. (pcs) 10000 4000 4000
chip ferrite bead for high speed revision december 18, 2015 4 / 5 @ un semiconductor co., ltd. 2015 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information.
chip ferrite bead for high speed revision december 18, 2015 5 / 5 @ un semiconductor co., ltd. 2015 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. test item test condition criteria temperature cycle a. temperature : -40 ~ +85 b. cycle : 100 cycles c. dwell time : 30minutes measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b.impedance value should be within 20 % of the initial value operational life a. temperature : 125 5 b. test time : 1000 hrs c. apply current : full rated current measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b.impedance value should be within 20 % of the initial value biased humidity a. temperature : 40 2 b. humidity : 90 ~ 95 % rh c. test time : 1000 hrs d. apply current : full rated current measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. impedance value should be within 20 % of the initial value resistance to solder heat a. solder temperature : 260 5 b. flux : rosin c. dip time : 10 1 sec a. more than 95 % of terminal electrode should be covered with new solder b. no mechanical damage c.impedance value should be within 20 % of the initial value steam aging test a. temperature : 93 2 b. test time : 4 hrs c. solder temperature : 235 5 d. flux : rosin e. dip time : 5 1 sec more than 95 % of terminal electrode should be covered with new solder
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